We implemented and released the software licensing for B-SIM and T-SIM to remove hardware dongles as more comfortable way to use both applications.

We kindly invite our customers and people who are interested in simulation applications used for the thermoforming and blow molding to see us at the K 2022 held in Düsseldorf, Germany, on 19 - 26 October 2022. Visit us at Hall 3, Booth E71-08.

We introduce the true 3D version of T-SIM and B-SIM. Completely new user interface, advanced features and improvements. Visit us at Hall 3, Booth E71-08.

HISTORY